ICパッケージ

ICパッケージラインナップ

  • Dicing up to 8” wafer diameter
  • Die sort into 2 / 3 / 4” waffle packs, Gel-packs, Jedec trays
  • Die sizes from 0.5mm and up
  • Up to 6” wafer diameter capability (Die sorting)
  • Ink dot input
  • Manual pick and place for pressure sensitive devices
  • Vacuum seal dry packing
  • Customized labeling
  • Visual / Final inspection

For more information, please contact our sales.

info@hamadatec.co.jp