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HAMADA TECHNOS CO.,LTD. delivers IC packaging services. After receiving wafers from clients, we accordingly assemble ICs in the packages listed below. 

Package

Pin
count

Body size
(exclude outer lead)

Lead pitch

SOT89-3

3

4.5 × 2.5 × t1.5mm

1.5mm

SOT89-5

5

4.5 × 2.5 × t1.5mm

1.5mm

SOT23-5

( TSOT23-3/5/6/ )

5

(3/5/6)

2.9 × 1.6 × t1.1mm

(2.9 × 1.6 × t1.0mm)

0.95mm

SOT23-6

6

2.9 × 1.6 × t1.1mm

0.95mm

SC-82AB

4

2.0 × 1.25 × t0.9mm

1.3mm

SC-88A

5

2.0 × 1.25 × t0.9mm

0.65mm

SON2017-6

6

2.0 × 1.7 × t0.75mm

0.65mm

SOP-8
HSOP-8

8

4.9 × 3.9 × t1.5mm

1.27mm

HSOP-6

6

4.9 × 3.9 × t1.5mm

1.9mm
 
   
　　

CONTACT_US         
  Technical department / Sales section
  66 Shimoakasaka, Kawagoe-shi, Saitama, 3501155 Japan
  Tel. +81-49-243-5616／Fax. +81-49-243-5863
  E-Mail: info@hamadatec.co.jp

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