|
| HAMADA TECHNOS CO.,LTD enforces
reliability testing which is in compliance with JEITA, JIS, SS, etc.
Please ask us for more information. |
| Test
item |
Test
condition |
|
Soldering heat |
reflow soldering |
Ta=260°C ± 3°C
(peak temp) |
min: 3times |
|
flow soldering |
Ta=260°C |
10sec / 2times |
|
hand soldering |
Ta=410°C |
each terminal /
above 5sec |
|
Solder wettability |
Ta=245°C |
zero cross time
within 3sec |
|
Solderability |
Ta=245°C |
3sec |
|
Resistance to dissolution of
metallization |
Ta=260°C |
30sec |
| High
temperature storage |
Ta=150°C |
1,000h |
|
Humidity |
Ta=85°C / RH=85% |
1,000h |
|
Temperature cycling |
Ta=-65°C
to+150°C (each 30min+room
temperature 5min) |
1,000cyc |
|
Pressure cooker (PCT) |
Ta=121°C /
RH=100% |
100h |
|
Delamination |
Cross-sectioning |
- |
| Body
strength |
Load test |
- |
|
Terminal strength |
Load test / a
weight |
- |
|
Whisker |
Room temperature |
Ta=25°C |
above 1,000h |
|
Heat |
Ta=50°C |
1,000h |
|
Humidity |
Ta=60°C / RH=90% |
1,000h |
|
Temperature cycling |
Ta=-40°C - 85°C
(each above 7min) |
1,500cyc |
| Peel
strength test for soldering joint |
Temperature
cycling (Ta=-35°C to+105°C / each
above 15min / 1,000cyc) comparison a
normal conditions with temperature
cycling conditions |
- |
|
Bending test for surface mount
devices on the board |
Bending width
(3mm) |
maintain 5sec |
| Push
strength test for soldering joint |
Temperature
cycling (Ta=-35°C to+105°C / each
above 15min / 1,000cyc) measurement
limit strength by load |
- |
|
Reiterative bending test for surface
mount devices on the board |
Bending width
(1mm) |
3,000cyc |
|
Board level drop test method of SMDs
(six faces) |
300mm: each
faces 100times / 1,500mm:
each10times |
- |
|
|
